发明名称 |
Method of producing a multi-layered wiring board |
摘要 |
Method of producing a multi-layered wiring board comprising the steps of subjecting the photosensitive resin to exposure- and development-treatment to form the holes having a predetermined size and shape; depositing and forming the curable resin to the insulating layer having the holes formed therein in such a manner as to bury the holes, and conducting heat-treatment to form the cured thin film of the curable resin on the surface of the insulating layer; and so removing the curable resin as to leave the cured thin film to obtain the via-holes having the reduced opening size by the cured thin film.
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申请公布号 |
US2001025414(A1) |
申请公布日期 |
2001.10.04 |
申请号 |
US20000738855 |
申请日期 |
2000.12.18 |
申请人 |
TOYOSHIMA TOSHIYUKI;YANAURA SATOSHI;FURUHASHI YASUO;FUJIOKA HIROFUMI |
发明人 |
TOYOSHIMA TOSHIYUKI;YANAURA SATOSHI;FURUHASHI YASUO;FUJIOKA HIROFUMI |
分类号 |
H05K3/00;H05K3/40;H05K3/46;(IPC1-7):H05K3/02;H05K3/10 |
主分类号 |
H05K3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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