Lead structure for sealing package

摘要

A sealing package for an integrated circuit chip including a lead structure with first lead members and second lead members. The first lead members are located proximate the corners of the sealing package and have two lead portions external to the sealing package and one lead portion internal to the sealing package. The second lead members are fanned out along the sides of the sealing package and have one lead portion internal to the sealing package and one lead portion external to the sealing package. Each first lead member adapted to provide a connection to ground for at least two sides of the sealing package. Each second lead member adapted to provide a connection between an integrated circuit chip internal to the sealing package and external circuitry.