PACKAGE FOR HIGH FREQUENCY, POWER MODULE SUBSTRATE FOR HIGH FREQUENCY, AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a package for high frequency for which an inexpensive heat sink plate having a high heat radiating characteristic can be used and which can prevent the occurrence of warping and dendrites, and to provide a power module substrate for high frequency and its manufacturing method. SOLUTION: The package 10 for high frequency has a ring-like frame body 12 bonded to the surface of the rectangular heat sink plate 11. The plate 11 is composed of a Cu or Cu-based metal plate having a high heat radiating characteristic, and the ring-like frame body 12 is composed of a resin or ceramic insulating material having an electrical insulation property. In addition, the heat sink plate 11 and ring-like frame body 12 are bonded to each other by using a low-melting point bonding material 13 composed of a resin, solder, or glass. COPYRIGHT: (C)2004,JPO