发明名称 |
Bonding method for semiconductor device manufacture |
摘要 |
An improved method of semiconductor device manufacture is provided in which the surfaces of glass sealed feed-through terminals are mechanically abraded to a uniform matte finish prior to plating and subsequent assembly. The mechanical abrasion, which in the preferred embodiment is performed by dry sand blasting, reduces the cost and improves the yield in subsequent assembly bonding steps and in particular substantially eliminates cold forming defects on the terminal nail head surface such that electrical conductors can be ultrasonically bonded thereto.
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申请公布号 |
US3996659(A) |
申请公布日期 |
1976.12.14 |
申请号 |
US19760656910 |
申请日期 |
1976.02.10 |
申请人 |
MOTOROLA, INC. |
发明人 |
GAICKI, STANLEY;SUMMERS, ALBERT LOUIS |
分类号 |
H01L21/48;H01L21/52;(IPC1-7):B01J17/00 |
主分类号 |
H01L21/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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