| 发明名称 |
METHODS AND APPARATUS FOR CUTTING PROFILES |
| 摘要 |
An apparatus for cutting a profile, including: a cutter configured to make cuts on the profile having a first surface and a second surface, and having at least one rib on the first surface, wherein the cuts are made on the first surface of the profile; a first drive unit to drive the cutter forward and backward to and from the first surface of the profile; and a second drive unit to drive the cutter up and down along the first surface of the profile. |
| 申请公布号 |
US2016271708(A1) |
申请公布日期 |
2016.09.22 |
| 申请号 |
US201615169552 |
申请日期 |
2016.05.31 |
| 申请人 |
Seoul Laser Dieboard System Co., Ltd. |
发明人 |
Lee Sang Moo |
| 分类号 |
B23D15/00;B21D11/08;B23D23/00 |
主分类号 |
B23D15/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An apparatus for cutting a profile, comprising: a cutter configured to make cuts on the profile having a first surface and a second surface, and having at least one rib on the first surface, wherein the cuts are made on the first surface of the profile; a first drive unit to drive said cutter forward and backward to and from the first surface of the profile; and a second drive unit to drive said cutter up and down along the first surface of the profile. |
| 地址 |
San Diego CA US |
