| 发明名称 |
THIN SUBSTRATE PROCESSING DEVICE |
| 摘要 |
A thin substrate processing device includes a substrate processing unit configured to process a thin substrate, and a cooling unit configured to cool the thin substrate when the substrate processing unit is processing the thin substrate. |
| 申请公布号 |
US2016376697(A1) |
申请公布日期 |
2016.12.29 |
| 申请号 |
US201414648226 |
申请日期 |
2014.01.28 |
| 申请人 |
ULVAC, Inc. |
发明人 |
Fujinaga Tetsushi;Matsumoto Masahiro;Arai Makoto;Mase Eriko;Iwai Harunori;Takahashi Koji;Ihori Atsuhito |
| 分类号 |
C23C14/54;H01J37/34;C23C14/56;C23C14/34;H01J37/32;C23C14/50 |
主分类号 |
C23C14/54 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A thin substrate processing device comprising:
a substrate processing unit configured to process a thin substrate; and a cooling unit configured to cool the thin substrate when the substrate processing unit is processing the thin substrate. |
| 地址 |
Chigasaki-shi JP |
