| 摘要 |
PURPOSE:To simply form a chamfered structure in an electronic part of the type projected with lead wirings at both ends of a sealer by cutting the lead wirings with part remaining, and bonding a conductive ring of substantially the same length as the outer diameter of the sealer to form an electrode. CONSTITUTION:A pellet 2 is interposed between the end faces of large diameter parts of a pair of lead wirings 4, a cylindrical glass 1 which is inserted between the large diameter parts is heated, and fusion-bonded to form a sealer 6. The wirings 4 are cut with the length projected by several mm., from the sealer 6 remaining, a conductive ring or metallic disc of the size substantially coincident to the outer diameter of the sealer 6 is throttled by pressing, a ring-shaped electrode ring 10 is formed at the circular edge in a cap 7, which is engaged with the end of the sealer 6, the wirings 4 are bonded to the cap 7 via the bonding parts 8 by heating metal paste, thereby forming an electrode section 9. |
