| 摘要 |
Cooling of integrated circuits, using a fluid medium that is effective at a relatively low temp. is achieved by means of a nucleate boiling chip carrier with enhanced surface geometry. Rubble formation is promoted by the metallised cells of a foam-like material. The chip carrier comprises a readily available laminate of copper foil (21) on epoxid and glass, supported by a back plate (20). A graphite impregnated foam material (22) is held against the laminate by a large-celled foam material (22) acting as spacer under the copper anode
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