| 摘要 |
PURPOSE:To contrive to improve the water resistance of a semiconductor device by a method wherein the parts other than the chip mounting part of the lead frame are formed in a bent state in the direction vertical to the chip mounting part. CONSTITUTION:The parts other than the chip mounting part 10a of a lead frame 10 are bent in the direction vertical to the chip mounting part 10a, whereby each creeping distance l2 of the adhesive parts of the lead frame 10 and a resin 4 becomes longer. By this way, the water resistance of the semiconductor device can be made to significantly improve without making larger the dimension of the packages. |
