A system and method for polishing the edges of a plurality of semiconductor wafers rotates a stack of wafers against a polish one or more pads such that both the wafer edges and the sides of the edges are polished to a mirror finish. The polish pad has a series of grooves through which the wafer edges are passed to polish the sides of the wafer edges, or two pads are used, one with grooves and one without grooves.
申请公布号
US5274959(A)
申请公布日期
1994.01.04
申请号
US19920990001
申请日期
1992.12.11
申请人
TEXAS INSTRUMENTS INCORPORATED
发明人
DYER, LAWRENCE D.;STEPHENS, ANTHONY E.;ALLEN, FRANK;EASTON, KEITH M.;KENNON, JAMES A.;MEDDERS, JERRY B.;MEYER, III, FREDERICK O.