| 摘要 |
PURPOSE: To linearly cut a pattern edge part and to form an electrode pattern in which the film thickness is uniform by making a process forming a metallic film the process in which a substrate surface is set at the location where metallic particles are vertically entered and a film formation is performed. CONSTITUTION: On a lithium niobate piezoelectric substrate 1, a negative type photoresist 2 is applied and the formation of a pattern is performed by an exposure development. Next, an Al film 3a is formed on the substrate 1 and a pattern 2 by using an ion beam sputter. Next, the resist 2 and the Al film 3a are lifted off with resist exfoliation liquid and an Al electrode 3 is formed. The edge part of this electrode 3 is not notched, this chip is mounted on a package and a surface acoustic wave device is obtained. When the Al film is formed, the ion beam comining from an ion gun 5 hits a target 4, Al metallic particles springs out from the target, the particles adhere to the substrate 1 and the Al film 3 is formed. At this time, a substrate surface is set so that the Al particles may be vertically entered the substrate 1 by inclining the substrate 1 by an angleθfrom the surface parallel to the target 4.
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