发明名称 FLEXIBLE PRINTED BOARD
摘要 PURPOSE: To provide a flexible printed board which is free from curling, twisting, deflecting, etc., even if heat history is applied, and/or has sufficient adhesion, resistance against bending, size stability, etc., and is excellent in workability and industrially useful with a small curl after a conductor is etched, and a flexible printed board which can easily satisfy diverse needs of demanders. CONSTITUTION: A flexible printed board formed by applying a resin layer directly on a conductor and having at least the conductor and an insulator is of a multilayer structure wherein the insulator comprises a plurality of polyimide resin layers having different linear expansion coefficients from one another. In addition, a resin layer having a higher thermal expansion is in contact with the layer wherein conditions that a ratio (t2 /t1 ) of a thickness (t1 ) of the resin layer having the higher thermal expansion and a thickness (t2 ) of a resin layer having a lower thermal expansion is in a range of 0.01<t2 /t1 <20,000 (where t1 and t2 is a sum of thickness of respective resin layers) are satisfied.
申请公布号 JPH08250860(A) 申请公布日期 1996.09.27
申请号 JP19950294465 申请日期 1995.11.13
申请人 NIPPON STEEL CHEM CO LTD 发明人 WATANABE TAKASHI;AOI HARUHIKO;SATO SEIJI
分类号 B32B15/08;B32B15/088;C08G73/10;H05K1/03;H05K3/46;(IPC1-7):H05K3/46 主分类号 B32B15/08
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