| 摘要 |
PROBLEM TO BE SOLVED: To fine wiring metal without mixing board component, etc., into wiring metal, and stabilize the junction between aluminum nitride and wiring metal, and further enable the mounting of a high-speed and high-output semiconductor element. SOLUTION: In an aluminum nitride multilayer wiring board 1 where a plurality of aluminum nitride substrates 3 are stacked, at least one sheet of aluminum nitride substrate 3 forming wiring layers 2 and 2a contains at least one kind out of a copper oxide and a silver compound, out of plural aluminum nitride substrates 3, and also at least one kind is deposited within the wiring layers 2 and 2a out of copper, copper alloy, silver, and silver alloy. Moreover, the content of at least one kind out of copper oxide and the silver compound contained in the aluminum nitride substrate is 0.02-2.0mol% in terms of metal. |
