Semiconductor packages with sliding interconnect structure

摘要

A semiconductor package includes a first substrate including a plurality of first connecting portions disposed thereon, a second substrate disposed on a portion of the first substrate to be adjacent to the first connecting portions and including a plurality of conductive contact rails disposed thereon, and a plurality of conductive cantilevers respectively placed in contact with surfaces of the conductive contact rails so that one end portion of each conductive cantilever is electrically coupled to one of the first connecting portions and the other end portion slides along one of the conductive contact rails.

主权项

1. A semiconductor package comprising:
a first substrate including a plurality of first connecting portions disposed on the first substrate; a second substrate comprising a semiconductor chip body including a plurality of conductive contact rails disposed thereon, wherein the second substrate is placed over the first substrate to be adjacent to the plurality of first connecting portions; and a plurality of conductive cantilevers, one end portion of each conductive cantilever being electrically coupled to the respective first connecting portion, wherein the other end portion of each conductive cantilever remains placed in an electrical contact with a surface of the conductive contact rail while sliding along the surface of the conductive contact rail.