| 摘要 |
PROBLEM TO BE SOLVED: To remove particles stuck to the tip of a probe needle, and also to suppress electrical continuity failure. SOLUTION: A polysilicon layer 6 connected to a gate electrode is formed on a silicon substrate 7, an interlayer insulating film 5 is formed thereupon, and further the bonding pad where a metal layer 2, 3, 4, having a three-layer structure, is contacted directly and laminated, is formed thereupon. By forming an opening 22 through the third metal layer 2 and a barrier metal layer 1, 1 above and below the metal layer, the convexoconcave surface is formed on this bonding pad surface.
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