ELECTRONIC PACKAGE OF LIGHT DETECTING SEMICONDUCTOR DEVICE AND PACKAGING METHOD THEREOF TO FABRICATE ASSEMBLY PART AND DETECTION PART AS UNIT OF SUBSTRATE OF LARGE AREA LIKE WAFER OR LARGE PANEL

摘要

PURPOSE: An electronic package of a light detecting semiconductor device is provided to fabricate an assembly part and a detection part as a unit of a substrate of a large area like a wafer or a large panel by using a process and a structure that are proper for mass production. CONSTITUTION: An assembly part has a substrate made of a transparent material with respect to light with a predetermined wavelength range. A detection part includes at least one light detecting die that photoelectrically converts light into the predetermined wavelength range. The detection part is coupled to the assembly part by a plurality of the first solder bumps. The assembly part includes at least one of the first metal layers disposed in the periphery of the upper surface region of the substrate and at least one passivation layer extending over the first metal layer. The passivation layer is patterned to define a plurality of the first and second approach openings that indicate a plurality of the first and second solder bump pads(402) over the first metal layer. Each approach opening is connected to at least one of the second solder bump pads. A light detection region confronting the upper surface region is located in the light detecting die. A plurality of solder bump pads electrically connected to the light detection region is formed on the light detecting die. Each of the first solder bump extends between one of the solder bump pads and one of the first solder bump pads.