| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To solve problems that, in a mounting substrate, a support substrate which originally is not necessary is required and excessive material is needed, and moreover, the thickness of the support substrate causes an electronic circuit device to be large size, in cases where a printed circuit board, a ceramic substrate, or a flexible sheet etc. are adopted, and especially, to realize a low-profile electronic circuit device, the flexible sheet made of a thin resin is adopted, when the electronic circuit component is mounted in the substrate. <P>SOLUTION: After forming an isolation groove 72 in a conductive foil 70, the conductive foil 70 is used as a support substrate and an insulating resin 50 is deposited on the conductive foil 70. After reversing the insulating resin 50, in turn, the insulating resin 50 is used as a support substrate and the conductive foil is ground and is isolated as a conductive path. Accordingly, the circuit is constituted by a necessary and minimum material and also can be manufactured. Furthermore, by embedding the conductive path 51 in the insulating resin 50 and incurvating a side face of the conductive path 51 or providing eaves, the substrate in which falling-off of the conductive path 51 is prevented can be realized. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
