发明名称 RESIN MOLDING METHOD AND RESIN MOLDING DEVICE
摘要 <p><P>PROBLEM TO BE SOLVED: To achieve a quality resin molding without making un-filling and voids of a resin in a resin molding section and to reduce fraction defective of a product. <P>SOLUTION: The resin molding method comprises the compression molding of an article 60 to be molded while the article 60 to be molded with a sealing resin 70 is clamped by using a resin molding mold 20. In a filling process which fills up a cavity with a resin, an upper fixture 36 and a lower fixture 38 which support the article 60 to be molded and the above resin 70 are separated from an upper mold 32 which is arranged facing the above upper fixture 36 or a lower mold 34 which is arranged facing the above lower fixture 38. After the above filling process, in a compression molding process which compresses and molds the resin which was filled in the above cavity, the above upper fixture 36 and the upper mold 32 are abutted, the above lower fixture 38 and the lower mold 34 are abutted, and the resin molding is performed by carrying out the thermosetting of the above resin 70. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p>
申请公布号 JP2006027098(A) 申请公布日期 2006.02.02
申请号 JP20040209832 申请日期 2004.07.16
申请人 APIC YAMADA CORP 发明人 MIYAGAWA TSUTOMU;GOTO NAOYA;NAKAZAWA HIDEAKI;KOBAYASHI KAZUHIKO
分类号 B29C43/18;B29C43/32;B29C43/34;B29C43/36;H01L21/56 主分类号 B29C43/18
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