| 摘要 |
PROBLEM TO BE SOLVED: To provide a photosensitive resin composition for an optical waveguide which can prevent the peeling of the optical waveguide from a base material over a long period under a condition of high temperature and high humidity or the like by being used as a material of a lower part clad layer of the optical waveguide to ease the shrinkage stress occurring in the formation of the optical wavequide. SOLUTION: The photosensitive resin composition contains (A) 35-69.98 mass% urethane (metha)acrylate, (B) 30-64.98 mass% compound containing one ethylenic unsaturated groups, 0-20 mass% (metha)acrylate containing≥2 acryloyl group, (D) 0.01-10 mass% radical photopolymerization initiator and (E) 0.01-3 mass% antioxidant. The photosensitive resin composition 2 is applied on the substrate 1 to form the 1st lower part clad layer 4 constituting the optical waveguide 13. COPYRIGHT: (C)2006,JPO&NCIPI |
