Process for activating substrate surfaces for the direct partial metallization of support materials.

摘要

Metallised substrate surfaces, especially circuit boards for printed circuits, are advantageously obtained by applying metal- organic compounds, homogeneously distributed in organic solvents, of elements of subgroups 1 and 8 of the periodic table by the ink-mist or ink-jet process to the support boards and immediately introducing the thus pretreated substrates after sensitisation into a currentless metallisation bath.