| 摘要 |
PURPOSE:To reduce the heat-resistance of contact by a method wherein a mirror plane plate is adhered on the back side of an integrated circuit element so that the mirror plane faces to outside, a mirror plane plate is adhered on a cooling member corresponding to the integrated circuit element so that the mirror plane faces to the outside, then the mirrors are contacted each other. CONSTITUTION:A mirror plane plate 16 is adhered on the back side of an integrated circuit element with adhesive 17 so that the mirror plane faces to the outside, a mirror plane plate 18 is adhered on the plane which faces to the back side of the integrated circuit element of a radiator 13 with adhesive 19 so that the mirror plane faces to the outside, with two mirrors contacting each other. When the mirror plane plates 16 and 18 are made of at least a plate consisting of a material with large heat-conductivity such as silicon, etc. whose one plane is polished to a mirror. A plane or a curved surface with at least the curvature radius of 100m is desirable for the plane. In this structure, the gap between the section where the mirrors of the mirror plane plates 16 and 18 contact each other will be small, with small heat-resistance (contact heat-resistance) even if air exists in the gap.
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