发明名称 CHIP FORM ELECTRONIC COMPONENT
摘要 <p>PURPOSE:To attain the use of a square vacuum chuck in mounting components onto a printed board by a mount machine by using a square outer packaging member so as to cover a part of a side face of a chip main body not covered by a cap terminal. CONSTITUTION:A part not covered by cap terminals 5a, 5b at the side face of the chip main body 1 whose outer shape is cylinder is covered by an outer packaging member 6 whose outer shape is, e.g., of regular square pillar shape to form a chip component whose outer shape is square. The distance D between the side face of the outer packaging member 6 and the side face of the cap terminals 5a, 5b is selected within a range of +0.2mm--0.2mm. For example, when the cap terminals 5a, 5b are soldered respectively to electrodes 71a, 71b of a printed board 7 by flow solder or the like with the member 6 sticked to the printed board 7 by an adhesives 8, if the distance D is larger than +0.2mm, the gap G between the cap terminals 5a, 5b and the electrodes 71a, 71b is too large and the reliability of soldering is lowered. If the distance D is larger than -0.2mm, the sticking by the adhesives 8 is made difficult.</p>
申请公布号 JPS6210911(A) 申请公布日期 1987.01.19
申请号 JP19850151081 申请日期 1985.07.08
申请人 MURATA MFG CO LTD 发明人 HAMURO MITSUO
分类号 H03H9/02;H01C1/02;H01G2/02;H01G4/28;H01L41/053;H03H9/10;H05K3/30;H05K3/34 主分类号 H03H9/02
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