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发明名称
METHOD FOR APPLYING BONDING AND COATING RESIN
摘要
申请公布号
JPH02169068(A)
申请公布日期
1990.06.29
申请号
JP19880324332
申请日期
1988.12.22
申请人
FUJI ELECTRIC CO LTD
发明人
KAMIJO KENJI
分类号
B05D1/28;B05D3/00;H01L21/31;H01L21/56
主分类号
B05D1/28
代理机构
代理人
主权项
地址
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