发明名称 IMPROVED PROTECTED CONDUCTIVE FOIL ASSEMBLAGE AND PROCEDURE FOR PREPARING SAME USING STATIC ELECTRICAL FORCES
摘要 A conductive copper foil (20) for use in preparing printed circuit boards is protected from damage during storage, shipment and further processing by covering at least one side of the foil (20) with a sheet of plastic film (24). The film (24) is removably joined with the foil (20) as a result of the essential absence of gaseous material between the film (24) and the foil (20). Thus, the film (24) conforms intimately to the contours and shape of the foil surface and clings tightly thereto to permit movement and further processing of the foil (20) with the film (24) adhering tightly thereto. The absence of air between the film and the foil is produced by oppositely statically electrically charging the film (24) and the foil (20) such that they are forced together sufficiently to squeeze the air out from therebetween. The film (24) is selected to be sufficiently resistant to laminating temperature and pressure conditions so as to remain in its covering, protecting relationship to the foil and avoid sticking to the laminating press plate and retain its removability from the foil (20) after lamination. <IMAGE>
申请公布号 AU2527292(A) 申请公布日期 1993.04.08
申请号 AU19920025272 申请日期 1992.09.23
申请人 GOULD INC. 发明人 JAMIE H. CHAMBERLAIN;ROLLAND D. SAVAGE;JOHN P. CALLAHAN;DAVID P. BURGESS
分类号 B32B7/06;H01B17/62;H05K1/09;H05K3/02 主分类号 B32B7/06
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