| 摘要 |
PROBLEM TO BE SOLVED: To perform the stable measurement of film thickness to a substrate in etching treatment. SOLUTION: In a substrate processor which performs etching treatment by soaking a substrate 9 in etchant in condition that the substrate 9 is supported in erect posture in a guide groove 321 made in a support member 32, the measurement end 421 of an optical fiber 42 is positioned at the inner face of the guide groove 321a for supporting the substrate 9a whose film thickness is to be measured. A measurement beam 42La is emitted from the optical fiber 42, and the reflected light 42Lb from the substrate 9 is led to a film thickness meter through an optical fiber 42. As a result, the positional relation between the substrate 9 and the measurement end 421 does not change in every treatment, and further even if the substrate 9 vibrates, the fluctuation of the distance between the substrate 9 and the measurement end 421 can be minimized. As a result, the stable measurement of the film thickness of the substrate 9 is materialized.
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