发明名称 HEAT TREATING DEVICE
摘要 PROBLEM TO BE SOLVED: To make a heat treating device controllable in the optimum state in accordance with the contents of the treatment performed by means of a heating source. SOLUTION: A substrate W is placed on a hot plate 20 for heat treatment. The temperature of the plate 20 is measured by means of a temperature sensor 25. A temperature control section 15 makes PID control on the temperature of the plate 20 based on the result of the measurement by means of the sensor 25. A PID constant deciding section 16 decides the PID constant for the PID control performed by means of the control section 15. The PID constant decided by means of the deciding section 16 varies depending upon that whether the hot plate 20 actually treats the substrate W or the set temperature of the plate 20 is changed and, even when the set temperature is changed, in addition, depending upon the changed temperature width or temperature zone.
申请公布号 JP2000294473(A) 申请公布日期 2000.10.20
申请号 JP19990094545 申请日期 1999.04.01
申请人 DAINIPPON SCREEN MFG CO LTD 发明人 MATSUSHITA MASANAO;SASADA SHIGERU
分类号 H01L21/027;(IPC1-7):H01L21/027 主分类号 H01L21/027
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