发明名称 RESIN MOLDING AND MOLD FOR MOLDING THE SAME
摘要 PROBLEM TO BE SOLVED: To enhance appearance performance of a punching part by simply conducting a gradation and parting of both embossed patterns in a resin molding having different embossed patterns of a surface of a general part and a surface of a punching part by integrally molding the punching part and a mold for molding. SOLUTION: The gradations and parting of both the embossed pattern 30a of the surface of the general part of the resin molding 30 and the embossed pattern 32a of the surface of a speaker grill (punching part) 32 are simply conducted by differentiating the patterns 30a and 32a and circumferentially providing groove parts 35 each for parting along a peripheral edge of the grill 32. Further, when the grill 32 is molded integrally with a lower door trim 30, protruding strips 57 of a suitable depth size are circumferentially provided at peripheral edges of a punching block 53 provided at a cavity mold 50 to simply mold the part 35 for parting.
申请公布号 JP2001353757(A) 申请公布日期 2001.12.25
申请号 JP20000175952 申请日期 2000.06.12
申请人 KASAI KOGYO CO LTD 发明人 IKETANI NAOKI
分类号 B29C45/37;(IPC1-7):B29C45/37 主分类号 B29C45/37
代理机构 代理人
主权项
地址
您可能感兴趣的专利