METHOD OF MANUFACTURING ELECTRONIC SUBSTRATE COMPRISING METHOD OF CLOSELY FORMING LINEAR CONDUCTIVE METALLIC MATERIALS BY FILLING UP ACCURATELY BORED OPENINGS OF RESIN PLATE FOR ELECTRONIC SUBSTRATE WITH GOOD CONDUCTIVE METALLIC POWDER OR GOOD CONDUCTIVE METALLIC POWDER MIXTURE CONTAINING APPROPRIATE AMOUNT OF BINDER AND MELTING THE POWDER OR MIXTURE BY IRRADIATING THE POWDER OR MIXTURE WITH MICROWAVE, OR THE LIKE

摘要

PROBLEM TO BE SOLVED: To provide a method of manufacturing electronic substrate by which very fine good conductors can be passed through openings even when the openings are bored at narrow intervals by using a very fine drill, ultrasonic wave, laser beam, to meet the demand for an electronic substrate having openings bored at narrower intervals without requiring much time nor hindering mass production. SOLUTION: In this method, the step of passing very fine good conductors through the openings of a resin plate for electronic substrate having bored openings is not performed, but the conductors are produced in the openings by producing linear good conductive metallic material in the openings of the resin plate by filing up the openings with good conductive metallic powder prepared by pulverizing a good metallic conductor or a slurry-, compound-, or clay-like good metallic powder mixture prepared by mixing the binder with the metallic powder and heating and melting the powder or mixture by irradiating the powder or mixture with a microwave, etc.