发明名称 |
Semiconductor device and method of forming |
摘要 |
A semiconductor device having a substrate support (22) and a method of forming the semiconductor device. A substrate (11) has conductive traces (12) and a bonding pad (13) on a bottom surface and conductive traces (14) and a semiconductor chip attach pad (17) on a top surface. The substrate support (22) has an aperture (23) and is coupled to the substrate (11). A semiconductor chip (31) is coupled to the semiconductor chip attach pad (17). The semiconductor chip (31) is covered by an encapsulating material (38) or a cap (41, 51) which provide protection for the semiconductor chip (31). |
申请公布号 |
EP0690497(B1) |
申请公布日期 |
2002.05.02 |
申请号 |
EP19950109712 |
申请日期 |
1995.06.22 |
申请人 |
MOTOROLA, INC. |
发明人 |
HECKMAN, JAMES K.;CARNEY, FRANCIS J.;GEYER, HARRY J. |
分类号 |
H01L23/12;H01L23/04;H01L23/057;H01L23/31;H01L23/498 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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