BAKE APPARATUS FOR FABRICATING SEMICONDUCTOR

摘要

PURPOSE: A bake apparatus for fabricating a semiconductor is provided to install stably a guide member on a loading plate by forming components of the guide member with one body. CONSTITUTION: A loading plate(100) has a shape of disc. A plurality of guide members(200) is arrayed on a peripheral edge portion of the loading plate(100). A plurality of wafer support balls is installed on a surface of the loading plate(100). A plurality of elevation pins is installed on a center part of the loading plate(100). The guide member(200) includes a cone-shaped body portion(210). A spacer portion(220) is formed at a lower end of the body portion(210). The thickness of the spacer portion(220) is about 10mm. A combination groove(230) is formed in a lower face of the body portion(210). A combination groove(101) is formed in the loading plate(100). The guide member(200) and the loading plate(100) are combined by a combination screw(240).