发明名称 APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR
摘要 PROBLEM TO BE SOLVED: To provide an apparatus and a method for manufacturing a semiconductor in which by-products in an exhaust pipe coupled with a processing chamber can be prevented from scattering to flow back into the processing chamber at the time of recovering the processing chamber from a pressure reduced state. SOLUTION: The apparatus for manufacturing a semiconductor comprises a processing chamber in which an article being processed is placed, an exhaust pipe for discharging gas in the processing chamber to the outside, and a control valve provided in a gas supply pipe and controlling the flow of pressure recovering gas at the time of raising the pressure in the processing chamber under the pressure reduced state by supplying the pressure recovering gas thereto. In the method for manufacturing a semiconductor using the apparatus, the control valve discharges a part of the pressure recovering gas supplied to the processing chamber to the outside when the pressure recovering gas is supplied to the processing chamber under the pressure reduced state.
申请公布号 JP2003037067(A) 申请公布日期 2003.02.07
申请号 JP20010208191 申请日期 2001.07.09
申请人 APPLIED MATERIALS INC 发明人 IWAMA KAZUYOSHI
分类号 C23C16/455;H01L21/205;(IPC1-7):H01L21/205 主分类号 C23C16/455
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