发明名称 METALLIC OXIDE PARTICULATE-DISPERSED BODY
摘要 PROBLEM TO BE SOLVED: To inexpensively provide a metal oxide-dispersed body capable of depositing a metallic thin film having a low volume resistance value, particularly, a copper thin film by low temperature heat treatment under an ordinary pressure or higher. SOLUTION: The metallic oxide particulate-dispersed body comprises metallic oxide particulates with a primary particle diameter of ≤100 nm and a reducible organic polymer having reducibility to the metal oxide particulates, and in which ≥95 wt.% is dissipated at a temperature in which reduction action is caused or higher. The metallic oxide particulate-dispersed body is film-deposited, and is thereafter subjected to heat treatment to reduce the metallic oxide particulates, and simultaneously with the reduction or after the reduction, the reducible organic polymer is dissipated by ≥95 wt.% of the weight before the heat treatment, so that the metallic thin film can be produced. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005002418(A) 申请公布日期 2005.01.06
申请号 JP20030167672 申请日期 2003.06.12
申请人 ASAHI KASEI CORP 发明人 MARUYAMA MUTSUHIRO
分类号 C01G1/02;C01G3/02;C23C18/02;C23C18/40;(IPC1-7):C23C18/02 主分类号 C01G1/02
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