| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method for mounting an electrical part capable of thinning the thickness of a module after a chip mounting more than conventional techniques. <P>SOLUTION: The method for mounting the electrical part has a process in which an opening section 1a having a specified size is formed to a substrate 1 to which a specified wiring pattern is formed, and the process in which a support film 3 supporting a specified IC chip 4 is laminated on one surface of the substrate 1 so as to coat the opening section 1a. The method further has the process in which the IC chip 4 is arranged on the support film 3 in the opening section 1a of the substrate 1, the process in which the IC chip 4 is connected electrically to the wiring pattern of the substrate 1, and the process in which the IC chip 4 and its peripheral region are sealed. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
