| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device having high connecting reliability which can maintain the connectivity of the semiconductor device to a circuit substrate satisfactory even when a temperature cycle is applied at the semiconductor device mounting time on the circuit substrate to the semiconductor device and the circuit substrate. SOLUTION: The semiconductor device 30 includes an interposer substrate 4 having wiring conductors on front and rear surfaces, and a semiconductor element 6 mounted on the front surface of the interposer substrate 4 in an electrically connecting state. The interposer substrate 4 in which the semiconductor element 6 is mounted, is mounted on the circuit substrate 28 having the wiring conductors on the front surface. Thus, the wiring conductor on the rear surface of the interposer substrate 4 is electrically connected to the circuit substrate 28. The thermal expansion coefficient C4 of the interposer substrate 4 exists between the value or the thermal expansion coefficient C6 of the semiconductor element 6 and the value of the thermal expansion coefficient C28 of the circuit substrate 28. COPYRIGHT: (C)2006,JPO&NCIPI |
