| 摘要 |
PROBLEM TO BE SOLVED: To provide a coating copper with long whisker formation suppressed, to provide a method for suppressing the long whiskers, and to provide a printed-wiring board with a wiring pattern formed by the coating copper, and to provide a semiconductor device. SOLUTION: The coating copper comprises a copper base material or a copper alloy base material, a copper diffused tin layer formed on the surface of the base material, and a pure tin layer formed on the surface of the copper diffused tin layer. The thickness of the copper diffused tin layer is not less than 55% of the total thickness of the copper diffused tin layer and the pure tin layer, and growth of the whiskers of the coating copper is suppressed. The printed wiring board with its wiring pattern comprising the copper base material and the copper alloy base material, and the semiconductor device are provided. The occurrence of the long whisker longer than 15μm, which causes a short circuiting, can be suppressed. COPYRIGHT: (C)2006,JPO&NCIPI |
