| 摘要 |
An ink composition for deposition upon the surface of a semiconductor device to provide a contact area for connection to external circuitry is disclosed, the composition comprising an ink system containing a metal powder, a binder and vehicle, a metal frit, and a fluxing agent. The ink is screened onto the semiconductor surface in the desired pattern and is heated to a temperature sufficient to cause the metal frit to become liquid. The metal frit dissolves some of the metal powder and densifies the structure by transporting the dissolved metal powder in a liquid sintering process. A two-step heating process may be used, the first step serving to activate the fluxing agent to prepare the semiconductor surface. The sintering process may be carried out in various types of atmospheres depending upon the metal powder utilized. A small amount of dopant, semiconductor material or a semiconductor-dopant eutectic alloy powder may be added to the ink system. |
