发明名称 |
PHOTOCURABLE COMPOSITION FOR NANOIMPRINTING, AND METHOD FOR FORMING FINE PATTERN USING THE SAME |
摘要 |
Provided is a photocurable composition that is used for nanoimprinting and can give, on a wafer, a uniform thin film that maintains a uniform thickness without causing uneven resin distribution even after being left stand for a certain time and still enables transfer of, and formation of, a fine pattern with good precision from a mold onto the thin film. The photocurable composition for nanoimprinting includes components (A), (B), (C), and (D) and includes the component (C) in a content of 1 to 30 weight percent based on the total amount (100 weight percent) of the photocurable composition. The component (A) is a cationically curable compound represented by Formula (1). The component (B) is a cationic photoinitiator. The component (C) is a hydroxy-containing solvent having a boiling point of 100° C. to 210° C. (at 760 mmHg). The component (D) is a solvent that is devoid of hydroxy, has a boiling point of 140° C. to 210° C. (at 760 mmHg), and has monomer solubility in terms of solubility parameter of 8.0 to 10.0 (cal/cm3)1/2.; |
申请公布号 |
US2016334701(A1) |
申请公布日期 |
2016.11.17 |
申请号 |
US201515111552 |
申请日期 |
2015.01.06 |
申请人 |
DAICEL CORPORATION |
发明人 |
FUJIKAWA Takeshi;YAMAMOTO Takuya |
分类号 |
G03F7/00;H01L33/00;G03F7/004 |
主分类号 |
G03F7/00 |
代理机构 |
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代理人 |
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主权项 |
1. A photocurable composition for nanoimprinting, comprising components (A), (B), (C), and (D) as follows:
(A) a cationically curable compound represented by Formula (1); (B) a cationic photoinitiator; (C) a hydroxy-containing solvent having a boiling point of 100° C. to 210° C. (at 760 mmHg); and (D) a solvent being devoid of hydroxy, having a boiling point of 140° C. to 210° C. (at 760 mmHg), and having monomer solubility in terms of solubility parameter of 8.0 to 10.0 (cal/cm3)1/2, the photocurable composition comprising the component (C) in a content of 1 to 30 weight percent based on the total amount (100 weight percent) of the photocurable composition, Formula (1) expressed as follows:wherein R1 to R18 are, identically or differently, selected from hydrogen, halogen, a hydrocarbon group optionally containing oxygen or halogen, and optionally substituted alkoxy; and X is selected from a single bond and a linkage group. |
地址 |
Osaka-shi, Osaka JP |