发明名称 Exposure apparatus with detection apparatus for detection of upper and lower surface marks, and device manufacturing method
摘要 A detection apparatus, which detects a mark formed on a lower surface of a target object, includes: a first detector which illuminates the mark from an upper surface side of the target object to detect an image of the illuminated mark; a second detector which detects an upper surface position of the target object; and a processor which obtains information indicating a focus position to focus on the mark in the first detector, based on the upper surface position detected by the second detector.
申请公布号 US9523927(B2) 申请公布日期 2016.12.20
申请号 US201313762476 申请日期 2013.02.08
申请人 CANON KABUSHIKI KAISHA 发明人 Maeda Hironori
分类号 G03F9/00;G01B11/14;G03F7/20;G01B11/00;G01B11/06;G01N21/41;G01S17/88 主分类号 G03F9/00
代理机构 Rossi, Kimms & McDowell LLP 代理人 Rossi, Kimms & McDowell LLP
主权项 1. A detection apparatus which detects a mark formed on a substrate permeable to infrared light and impermeable to visible light, the apparatus comprising: a first detector configured to detect a first mark formed on an upper surface of the substrate and a second mark formed on a lower surface of the substrate; a second detector configured to detect an upper surface position of the substrate for a focusing of the first detector; and a processor configured to perform detection processing of the first and second marks using the first and second detectors, wherein the first detector comprises: a light source configured to emit selectively visible light and infrared light;a photoelectric conversion device; andan optical system configured to form an image of the first mark on a light-receiving surface of the photoelectric conversion device using the visible light emitted by the light source, applied to the first mark from an upper surface side of the substrate, and reflected by the first mark, and to form an image of the second mark on the light-receiving surface of the photoelectric conversion device using the infrared light emitted by the light source, applied to the second mark from the upper surface side of the substrate, and reflected by the second mark; wherein in a case of detecting the first mark, the processor performs: a detection of the upper surface position of the substrate using the second detector; anda focusing of the first detector using the visible light while adjusting a distance of the substrate with respect to the first detector within a range including the detected upper surface position, and wherein in a case of detecting the second mark, the processor performs: a detection of the upper surface position of the substrate using the second detector; anda focusing of the first detector using the infrared light while adjusting a distance of the substrate with respect to the first detector within a range including a position offset by an offset amount based on a thickness of the substrate.
地址 Tokyo JP