HEAT SINK STRUCTURE, SEMICONDUCTOR DEVICE AND HEAT SINK MOUNTING METHOD

摘要

[Problem to be solved];In an electronic device that contains a plurality of heat-generating components, not all the heat-dissipation capabilities of the heat-generating components having heights different from each other are secured in a lump.;[Solution];The heat sink structure of the invention includes: a first heat sink; a second heat sink having a protrusion in a lower part of a side surface thereof; a thermal conductivity substance sandwiched between a side surface of the first heat sink and a side surface of the second heat sink; and a flexible cushioning material sandwiched between the bottom surface of the first heat sink and the top surface of the aforementioned protrusion.

主权项

1. A heat sink structure, comprising:
a first heat sink; a second heat sink having a protrusion in a lower part of a side surface of the second heat sink; a first thermal conductivity substance sandwiched between a side surface of the first heat sink and a side surface of the second heat sink; and a flexible cushioning material sandwiched between a bottom surface of the first heat sink and a top surface of the protrusion.