| 摘要 |
<p>PURPOSE:To produce a module of a simple structure in an easy manner by a method wherein an adhesive material is interposed between an electrode terminal and a substrate core material, an IC electrically connected to the electrode terminal is held on the substrate core material, and at least the electrical joint of the electrode terminal to the IC and the IC are covered with a molding resin to be molded. CONSTITUTION:For producing a module 1A, for example, a polyester film subjected to an adhesive treatment is bonded as an adhesive material 12 on one surface of a substrate core material 13 made of, e.g., a glass epoxy material, and through holes 15 are provided correspondingly to connecting pins 8 of an IC 11. Next, an electrode-side metal foil 17, e.g., having a thickness of 35 mum for forming electrode terminals 3b is integrally laminated on the adhesive material 12 bonded to the substrate core material 13. Thereafter, this is etched to form a slit 3c, by which electrode terminals 3b independent of each other are formed. A nickel plating or gold plating is applied to the electrode terminals 3b. A solder plating is applied to the rear surface of the electrode-side metal foil 17 exposed through the through holes 15 for facilitating the connection of the connecting pins 8 of the IC 11.</p> |
