Improved wire scribed circuit boards and methods of their manufacture

摘要

The invention concerns an interconnection board for connecting electonic, electro-optical and/or optical devices and methods of manufacturing such boards. The interconnections are formed by scribing electrically or optically conductive filaments to form a signal conductor layer. The interconnection board comprises a base as a support member, an signal conductor layer laminated to the base and a surface conductor layer laminated to the signal conductor layer. The interlayer connections between the signal conductor layer and the surface conductor layer are formed by segments of the conductive filaments of the signal conductor layer displaced from the signal conductor layer to the vicinity of surface of the interconnection board to form part of or connect with the surface conductive pattern.