发明名称 TUNGSTEN-COPPER COMPOSITE POWDER, COMPOSITE OXIDE POWDER AND METHOD FOR MAKING TUNGSTEN-COATED COPPER COMPOSITE POWDER AND METHOD FOR FORMING A HOMOGENEOUS W-CU PSEUDOALLOG
摘要 A high performance W-Cu composite powder is provided which is composed of individual particles having a tungsten phase and a copper phase wherein the tungsten phase substantially encapsulates the copper phase. The tungstencoated copper composite powder may be pressed and sintered into W-Cu pseudoalloy articles having a homogeneous distribution of W and Cu phases without experiencing copper bleedout or it may be used in ceramic metallization for the electronics industry. <IMAGE>
申请公布号 HU9603166(A2) 申请公布日期 1997.07.28
申请号 HU19960003166 申请日期 1996.11.15
申请人 OSRAM SYLVANIA INC. 发明人 DORMAN,LEONID P;HOUCK,DAVID L.;MEYERS,GAIL T.;PALIWAL,MUKTESH;SCHEITHAUER,MICHAEL J.;VENSKYTIS,FRANK J.
分类号 B22F1/00;B22F1/02;B22F9/22;C01G41/00;C04B41/51;C04B41/88;C22C1/04;H01H1/025;H01L23/498;H05K1/09;(IPC1-7):C01G3/00 主分类号 B22F1/00
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