| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer wiring board suitable for an electronic circuit board or the like, which comprises orthogonally layered parallel sets of wirings, has a wiring construction enabling to reduce crosstalk noise between sets of wiring, moreover to which EMI measures can be taken with no degradation in electrical characteristics and on which electronic components such as semiconductor devices operating at high speed are mounted. SOLUTION: A multilayer wiring board is provided with a multilayer wiring which is formed by electrically connecting through through-conductors a first wiring layer L1, comprised of sets of parallel wiring which are formed on a first insulting layer I1 are 2-4 straight lines having their point of intersection in the center of an insulating layer I1 and respectively directed towards the intersection side in segments divided, in such a way that their center angles are spaced approximately uniformly and a second wiring layer L2, which is formed on a second insulating layer I2 stacked on the first insulating layer I1 and is comprised of sets of parallel wiring orthogonal to the first wiring layer L1 respectively in the segments. In this way, the second wiring layer is disposed approximately in the form of a ring and has shield effects against EMI noise. |
