HEAT TREATMENT DEVICE

摘要

To give a predetermined heat treatment to a wafer (W) held on a holder (14) for a wafer to be treated in a treatment container (4) of a wafer heat treatment device, lower and upper heating means (16, 26) are disposed below and above the holder (14) for a wafer to be treated for heating the wafer to be treated. These heating means (16, 29) are mounted in lower and upper side heating means containers (6, 8), respectively. A gas supply means (28) is provided between the upper side heating means (8) and the holder (14) for a wafer to be treated for supplying treatment gas in a shower-like fashion. The uniformity of temperatures in the surfaces of the wafer can be improved by heating the wafer (W) from the upper and lower sides of the wafer (W).