METHOD OF MANUFACTURING LIGHT EMITTING DEVICE WITH EXPOSED WIRE END PORTIONS

摘要

A light emitting device is constituted with a semiconductor light emitting element on which a support member is disposed on one surface provided with a p-side electrode and an n-side electrode and a fluorescent material layer is disposed on the other surface which is an opposite side of the one surface. The support member includes a resin layer, an electrode for p-side external connection and an electrode for n-side external connection disposed exposed at a surface opposite side of a surface where the resin layer is in touch with a light emitting element, and internal wirings disposed in the resin layer and electrically connecting between a p-side electrode and the electrode for p-side external connection respectively. The internal wirings include a metal wire and a metal plated layer, and a metal wire and a metal plated layer respectively connected in series.

主权项

1. A method of manufacturing light emitting device comprising:
forming one or more light emitting elements each including a first conductive type semiconductor layer, a second conductive type semiconductor layer, a first electrode connected to the first conductive type semiconductor layer and a second electrode connected to the second conductive type semiconductor layer on a growth substrate; connecting first wires with the respective first electrodes and connecting second wires with the respective second electrodes; forming a first resin layer covering the light emitting elements so as to expose end portions of the respective first wires and end portions of the respective second wires; and forming first metal layers connected with the respective end portions of the first wires and forming second metal layers connected with the respective end portions of the second wires; and forming a second resin layer on the first resin layer so as to expose upper surfaces of the respective first metal layers and upper surfaces of the respective second metal layers.