Process for the currentless metallization of electrically non-conductive substrates

摘要

PCT No. PCT/DE96/00201 Sec. 371 Date Sep. 8, 1997 Sec. 102(e) Date Sep. 8, 1997 PCT Filed Feb. 9, 1996 PCT Pub. No. WO96/28588 PCT Pub. Date Sep. 19, 1996A process for the currentless metallization of electrically non-conductive substrates, includes providing a substrate which is electrically non-conductive; depositing on the substrate a positive lacquer comprising at least one polymer which is UV hardenable, at least one organo-metalllic compound, and a substance which is light-active to provide a positive lacquer coated substrate; irradiating the positive lacquer coated substrate with UV radiation to provide an irradiated coated substrate; and precipitating a metal layer onto the irradiated coated substrate by currentless metallization in a bath effective therefore.