发明名称 |
APPARATUS FOR TRANSFERRING LEAD FRAME IN ENCAPSULATION DISPENSER |
摘要 |
PURPOSE: An apparatus for transferring a lead frame in an encapsulation dispenser is provided to remarkably improve productivity by rapidly applying resin in the lead frame within a minimum work space, and to embody an economical production line by minimizing initial equipment cost and the work space. CONSTITUTION: Transfer belts(11) are installed on the opposite inner side surfaces of a pair of guide frames(10) which are in parallel with each other and separated by a predetermined interval. The first and second heater blocks(20,30) are formed in the front and rear between the pair of the guide frames. A vertical ball screw axially rotates by a motor. A heater block moving up/down unit(40) is screw-coupled to the ball screw so that a slide block can move up and down. A connecting rod(50) moves up/down the first and second heater blocks in connection with the heater block moving up/down unit. One end of the connecting rod is coupled to the first and second heater blocks, and the other end is coupled to the slide block. A part of the guide frame where the connecting rod passes is downwardly inserted to a guide hole(60) so that the connecting rod is located in a lower position by the transfer height of the lead frame in a state that the first and second heater blocks move down.
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申请公布号 |
KR20020018707(A) |
申请公布日期 |
2002.03.09 |
申请号 |
KR20000051946 |
申请日期 |
2000.09.04 |
申请人 |
KEC MECHATRONICS CO., LTD. |
发明人 |
HWANG, TAE SANG;LEE, SEONG NO |
分类号 |
H01L21/50;(IPC1-7):H01L21/50 |
主分类号 |
H01L21/50 |
代理机构 |
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主权项 |
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地址 |
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