发明名称 APPARATUS FOR TRANSFERRING LEAD FRAME IN ENCAPSULATION DISPENSER
摘要 PURPOSE: An apparatus for transferring a lead frame in an encapsulation dispenser is provided to remarkably improve productivity by rapidly applying resin in the lead frame within a minimum work space, and to embody an economical production line by minimizing initial equipment cost and the work space. CONSTITUTION: Transfer belts(11) are installed on the opposite inner side surfaces of a pair of guide frames(10) which are in parallel with each other and separated by a predetermined interval. The first and second heater blocks(20,30) are formed in the front and rear between the pair of the guide frames. A vertical ball screw axially rotates by a motor. A heater block moving up/down unit(40) is screw-coupled to the ball screw so that a slide block can move up and down. A connecting rod(50) moves up/down the first and second heater blocks in connection with the heater block moving up/down unit. One end of the connecting rod is coupled to the first and second heater blocks, and the other end is coupled to the slide block. A part of the guide frame where the connecting rod passes is downwardly inserted to a guide hole(60) so that the connecting rod is located in a lower position by the transfer height of the lead frame in a state that the first and second heater blocks move down.
申请公布号 KR20020018707(A) 申请公布日期 2002.03.09
申请号 KR20000051946 申请日期 2000.09.04
申请人 KEC MECHATRONICS CO., LTD. 发明人 HWANG, TAE SANG;LEE, SEONG NO
分类号 H01L21/50;(IPC1-7):H01L21/50 主分类号 H01L21/50
代理机构 代理人
主权项
地址