| 摘要 |
PROBLEM TO BE SOLVED: To reduce a vacant space, to realize a high-speed transfer, to improve yield and productivity, and to reduce power consumption in manufacturing an electronic component. SOLUTION: There are provided in upper and lower layers, clean tunnels 1, 13 that extend linearly and transfer a product, a group of units arranged linearly along the clean tunnels 1, 13, transfer cars 2, 14 that move in the clean tunnels 1, 13 and transfer the product, respectively. Lifting units 3, 3a, and 4, 4a are provided near the ends of clean tunnels 1, 13 to pass the product between the transfer cars 2, 14 and to form a loop-shaped transfer route that spreads over the upper and lower layers. |
