Substrate inspection device and component mounting device

摘要

A substrate inspection device and a component mounting device are provided. The solder inspection device and the component mounting device respectively have substrate support devices that support a rear face of a printed circuit board. The substrate support device includes backup pins that support the rear surface of the printed circuit board, a location determiner that determines locations of the backup pins, and a backup pin locator that places the backup pins at the locations of the backup pins determined by the location determiner. The location determiner determines positions for supporting areas of the rear face of the printed circuit board where an electrode is covered by a resist film and where neither electronic component nor solder is present, as the locations of the backup pins.

主权项

1. A substrate inspection device that inspects a surface of a substrate in a state that a rear face of the substrate is supported, wherein the substrate has an electrode, a resist film that covers a predetermined area of the electrode and solder provided to mount a specified electronic component in a specified position of the electrode,
the substrate inspection device comprising a substrate support device that supports the rear face of the substrate, wherein the substrate support device comprises:
a plurality of backup pins that supports the rear face of the substrate at upper ends thereof;a location determiner that determines locations of the backup pins; anda backup pin locator that places the backup pins at the locations of the backup pins determined by the location determiner, whereinthe location determiner determines positions for supporting areas of the rear face of the substrate where the electrode is covered by the resist film and where neither the electronic component nor the solder is present, as the locations of the backup pins.