| 摘要 |
PROBLEM TO BE SOLVED: To provide a coil-embedded integrated circuit substrate and a method of manufacturing the same.SOLUTION: A coil-embedded integrated circuit substrate includes a core substrate having an at least partially machined space formed therein, a coil disposed in the at least partially machined space, a filling material filling air gaps around the coil in the at least partially machined space, and insulating layers formed on upper and lower surfaces of the core substrate. Also provided is a method of manufacturing the same.SELECTED DRAWING: Figure 1 |
